Senior Standard Cell Design Engineer

Devesh Kadambari

Intel Corporation  ·  3A / 18A Process Node  ·  San Francisco, CA

Results-driven chip design engineer with 8+ years across semiconductors, automotive, and research. Passionate about building future AI products — from Liberty characterization to silicon that powers the next generation of intelligence.

8+
Years Experience
2
Intel Awards
5
Companies
6
Key Projects
00 — About Me

The Person Behind the Silicon

I'm Devesh Kadambari — a chip enthusiast at heart who genuinely believes that the future of humanity is written in transistors. By day I'm a Senior Standard Cell Design Engineer at Intel, pushing the boundaries of what's possible on 3A and 18A process nodes. By night I'm out under the stars, wondering about the physics of the universe at a completely different scale.

My journey into semiconductors started with a fascination for how invisible structures smaller than a virus can orchestrate the entire digital world. That curiosity has never left me. Whether I'm characterizing Liberty models at 3nm or reading about the James Webb Telescope's latest deep-field image, I'm always chasing the edge of what's known.

I grew up between India and the US, and that cross-cultural perspective shapes how I collaborate — I've worked with teams across Sweden, USA, and India and genuinely believe diversity of thought builds better silicon. I care deeply about mentoring the next generation of engineers and believe great engineering teams are built on trust as much as talent.

When I'm not in the lab or staring at SPICE waveforms, you'll find me on a trail somewhere in the Bay Area, planning my next adventure, or setting up a telescope in a dark field trying to spot something no one around me has ever noticed before.

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Astronomy

Amateur stargazer fascinated by cosmology, deep-sky objects, and space missions. Following JWST discoveries and dreaming of seeing the Milky Way core from a dark sky site.

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Hiking & Nature

Bay Area trail explorer — from the redwoods of Muir Woods to the ridgelines of Mission Peak. Nature resets the mind that spends its days thinking in nanometers.

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Exploring

Traveler with ties to India and a love for discovering new cultures, cuisines, and landscapes. Every new place is a fresh perspective on the world.

Chip Enthusiast

Genuinely excited about AI silicon, next-gen process nodes, and the race to build faster, more efficient chips. The future is being etched in atoms — and I want to be part of writing it.

01 — Competencies

Technical Skills

Cell Design & Physical

Standard CellPhysical Design DFT3A Node18A NodeLDE Analysis

Characterization

Liberty NLDMCCSTCCSN TimingNoisePowerSTAR-RC

EDA Tools

Cadence VirtuosoHSPICE PRIMESIMPSPICEHFSSAnsys

Programming

PythonMATLABVerilog C / C++CUDA

Hardware

OscilloscopeDMMLogic Analyzer Network AnalyzerFn Generator

Systems & AI

GPU ArchitectureCUDA Programming Static Timing AnalysisLLMsLinux / UNIX
02 — Work History

Career Experience

Mar 2022 — Present
Santa Clara, CA
🏅 Recognition Award × 2
Senior Standard Cell Design Engineer
Intel Corporation
  • Led end-to-end 3A & 18A standard cell design releases to block design, meeting critical quarterly roadmap milestones and customer committed timelines.
  • Directed development and validation of Liberty model files (NLDM/CCST/CCSN) ensuring high accuracy in timing, noise, and power characterization for downstream design teams.
  • Drove layout-dependent effects (LDE) analysis for lower node technologies, refining extraction accuracy for improved PPA outcomes.
  • Productized internal automation tools for circuit topology description and release flows, reducing manual modeling effort and library build turnaround time.
  • Owned release automation infrastructure builds, validation, and deployment — cutting errors and cycle time for 3A/18A library drops to IP and SoC stakeholders.
  • Spearheaded an early project pull-in by a quarter, delivering Intel's 3A/18A characterization collaterals ahead of schedule in collaboration with IP, Graphics, and SoC teams.
  • Enabled Intel's Extraction Hybrid Tool for process transition, earning a second recognition award for an associated publication.
Feb 2021 — Mar 2022
Aliso Viejo, CA
Product Engineer
Indie Semiconductor
  • Owned spec compliance matrix and production test plans to verify analog and mixed-signal IC performance.
  • Performed failure analysis and fault isolation to determine root causes; drove yield improvement using JMP and Yield Hub.
  • Led product reliability and package qualifications; coordinated with foundries from tape-out through assembly.
  • Provided real-time customer support for design, product, and quality-related concerns.
Jul 2019 — Dec 2020
Lowell, MA
Hardware Engineer
LEONINE Technologies Inc. (NSF-Funded)
  • Designed signal conditioners from piezo materials — pressure sensors, thermopile sensors, and calibrated position sensors.
  • Developed data acquisition software in C on Linux for Raspberry Pi and built regression models for behavioral analysis.
  • Reduced signal-to-noise ratio by introducing aluminum shielding to minimize EMC effects.
Sep 2017 — Jun 2019
Lowell, MA
Research Assistant
University of Massachusetts Lowell
  • Designed and simulated a FEM model of a Surface Acoustic Wave Resonator (BUZSAW) in HFSS from 1 MHz to 3 GHz.
  • Researched ST-CUT Quartz piezoelectric coupling and modeled crystal axis rotations via tensor analysis.
  • Achieved 95% effective power transfer improvement through coupling optimization.
May 2017 — Sep 2017
Lowell, MA
Hardware Engineer Intern
Veoneer — Autonomous Vehicles
  • Designed a 2-layer impedance board to measure PCB parasitic capacitances using a current injection module with Butterworth filter circuitry.
  • Performed Design Validation Testing (DVT) using Teradyne oscilloscope with a 4-member cross-functional team across Sweden, USA, and India.
  • Gained hands-on experience with 2D Camera, 3D LiDAR, and IMU processing for autonomous vehicle detection.
03 — Selected Work

Key Projects

Browse my work below.

P — 01

Intel 3A / 18A Liberty Model Release

Led end-to-end Liberty model file development (NLDM/CCST/CCSN) for Intel's most advanced process nodes. Pulled project in by a full quarter ahead of schedule in collaboration with IP, Graphics, and SoC teams — earning a recognition award.

LibertyNLDMCCST/CCSNPythonIntel PDK
P — 02

Release Automation Infrastructure

Productized internal automation tools for circuit topology description and library release flows. Infrastructure eliminated manual errors and cut cycle time for 3A/18A library drops to IP and SoC stakeholders across Intel.

PythonTclShellCI/CD
P — 03

Face Recognition CNN on NVIDIA GPU

Designed a 3-layer Deep Neural Network in C++ and CUDA for object detection and face recognition. Trained on the COCO dataset using an NVIDIA TITAN Xp, achieving 61% recognition accuracy.

CUDAC++TITAN XpCOCO Dataset
P — 04

BUZSAW — SAW Resonator FEM Model

Designed and simulated a Surface Acoustic Wave Resonator FEM model in HFSS, characterizing EM fields, port impedance, and S-parameters from 1 MHz to 3 GHz. Achieved 95% power transfer improvement through ST-CUT Quartz tensor modeling.

HFSSFEM SimulationMATLABPiezoelectrics
P — 05

Low-Power DSP-SRAM at 45nm

Designed an ALU and SRAM unit with a multi-divided word line and shared data line incorporating low-power techniques at 45nm. Optimized for leakage and dynamic power while maintaining performance targets.

Cadence VirtuosoSPICE45nm PDK
P — 06

Datapath PPA Optimization

Reduced supply voltage from 1.1V to 0.7V across pipelined and parallel datapath configurations, trading area for doubled performance. Analyzed clock distribution, setup, propagation, and hold times for multi-processor configurations.

HSPICEVerilogSTAPython
04 — Academic Background

Education

Master of Science
Computer Engineering (VLSI)

University of Massachusetts Lowell
Graduated December 2018

GPU Architecture & CUDA Programming, Advanced VLSI, Mixed-Signal VLSI, Computer Architecture, Static Timing Analysis, Operating Systems, Microprocessors II, Understanding of LLMs.

Bachelor of Engineering
Computer Engineering

University of Massachusetts Lowell
Graduated May 2017

Foundational coursework in digital circuits, microprocessors, embedded systems, and electronic design. Concurrent with early graduate research in RF/MEMS resonator design and simulation.

05 — Get In Touch

Let's Connect

Open to Staff-level roles at AI chip companies, semiconductor firms, and EDA/IP organizations. Passionate about AI silicon and next-generation process nodes.

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